The first made-in-India semiconductor chip will probably be launched in the market by the tip of this year, Prime Minister Narendra Modi stated on Friday (August 15, 2025).
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Addressing the nation on the 79th Independence Day, Mr. Modi stated that six semiconductor items are already on the bottom and 4 new items have been given inexperienced sign.
“By the end of this year, made in India, made by the people of India, made in India chips will come to the market,” Modi stated.
Semiconductors, key elements for any digital gadget, have various functions starting from cell phones and computer systems to dwelling equipment and electrical automobiles.
The Prime Minister stated that the thought course of for semiconductors in the nation began 50-60 years in the past, nevertheless it acquired caught in the recordsdata whereas a number of international locations have mastered it and are dominating the world.
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“My dear youth, you will be surprised to know that today, the semiconductor, which has become the strength of the world, 50-60 years ago, that thought process, those files, got stuck. They got stuck. The thought process of the semiconductor itself was foeticide 50-60 years ago. It lost 50-60 years. After us, many countries, in semiconductors, today, have mastered the technology and consolidated their power,” Mr. Modi stated.
The PM stated that he’s not on the Red Fort to criticise any authorities however it’s equally necessary for youth to learn about it.
He stated that the nation has now freed itself from the burden of the previous and is transferring ahead in the world of semiconductors in a mission mode.
The first recognized try to arrange a semiconductor plant in India was made by American physicist and entrepreneur Robert Noyce in late Nineteen Sixties earlier than he co-founded Intel with Gordon Moore.
Also Read | Govt. approves 4 semiconductor vegetation in Odisha, Punjab, Andhra Pradesh
India’s semiconductor market is anticipated to greater than double to develop in the vary of $100-110 billion by 2030, in accordance to business estimates, an official assertion stated on Sunday.
The Indian semiconductor market was about $45-50 billion in 2024-2025 in opposition to $38 billion in 2023, in accordance to an official assertion which cited business estimates.
The Union Cabinet this week accredited 4 semiconductor vegetation, together with a unit backed by U.S. know-how main Intel and Lockheed Martin, entailing a complete funding of ₹4,594 crore in three states of Odisha, Andhra Pradesh and Punjab.
The Cabinet accredited a 3D glass semiconductor packaging unit to be arrange by 3D Glass Solutions Inc — which is backed by U.S. know-how majors similar to Intel, Lockheed Martin and Applied Materials, entailing an funding of ₹1,943 crore with an annual manufacturing capability of 5 crore items.
This is the primary semiconductor mission that entails private laptop chip maker Intel Corporation together with different know-how companions.
The Cabinet accredited the nation’s first business compound fabrication unit by SiCsem for making silicon carbide semiconductors. The plant will probably be arrange in Bhubaneswar with an funding of ₹2,066 crore with a capability to produce 9.6 crore chips per year.
A chip packaging plant in Andhra Pradesh, to be arrange by Advanced System in Package Technologies with an funding of Rs 468 crore, was additionally accredited by the Cabinet. It may have a capability to produce 9.6 crore chips per year.
The Cabinet additionally cleared a semiconductor mission of electronics part maker agency CDIL. The facility will probably be arrange in Punjab with an funding of Rs 117 crore, having an annual manufacturing capability of 15.8 crore items.
The new semiconductor initiatives increase the full variety of chip vegetation in India to 10 with a cumulative funding dedication of round ₹1.6 lakh crore.
The chip vegetation which can be organising factories in advance phases embrace semiconductor wafer manufacturing items by Tata Electronics (TEPL) in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC) of Taiwan with a proposed funding of round ₹91,000 crore.
The different 5 vegetation are into the sphere of chip packaging, which embrace a unit by U.S. reminiscence chip maker Micron Technology with ₹22,516 crore funding, one by CG Power & Industrial Pvt Ltd in partnership with Renesas; Stars with ₹7,600 crore funding, a Tata Semiconductor Assembly and Test Pvt Ltd (TSAT) plant price ₹27,000 crore, a Kaynes Semicon unit of ₹3,307 crore and a unit of HCL-Foxconn JV entailing an funding of ₹3,700 crore.
