The Union Cabinet on Tuesday (August 12, 2025) accepted four tasks underneath the India Semiconductor Mission (ISM). Two of the tasks will probably be in Bhubaneswar in Odisha, and one every will probably be in Punjab and Andhra Pradesh. The cumulative worth of the tasks is ₹4,594 crore.
This brings the variety of tasks underneath the ₹76,000-crore mission, which gives monetary assist to semiconductor items, to 10.
The first chip from one of many earlier six items — some are competing, so it’s not clear which — will probably be rolled out in three months.
The companies behind the tasks are SiCSem (which can make a silicon carbide built-in facility in Info Valley, Bhubaneswar); Continental Device India Private Limited, which can increase its present “discrete semiconductor manufacturing facility” in Mohali; 3D Glass Solutions Inc., which can arrange a “vertically integrated advanced packaging and embedded glass substrate unit” in Bhubaneswar; and Advanced System in Package (ASIP) Technologies, which can arrange a semiconductor unit in Andhra Pradesh, with the situation but to be chosen.
Union Minister of Electronics and Information Technology Ashwini Vaishnaw mentioned that having the capability to work on silicon carbide know-how, an “evolving” discipline, was strategically vital for India. “IIT Bhubaneswar already has a ₹45 crore investment in a silicon carbide research unit, and the results have been very good,” he added.
